Intel Xeon E-2236. Processor family Intel Xeon E, Processor frequency 3.4 GHz, Processor socket LGA 1151 (Socket H4). Memory channels Dual-channel, Maximum internal memory supported by processor 128 GB, Memory types supported by processor DDR4-SDRAM. Thermal Design Power (TDP) 80 W. PCI Express configurations 1x16,2x8,1x8+2x4, Supported instruction sets SSE4.1,SSE4.2,AVX 2.0, Scalability 1S. Processor package size 37.5 x 37.5 mm
Processor special features
Enhanced Intel SpeedStep Technology
Y
Intel® Memory Protection Extensions (Intel® MPX)
Y
Intel Trusted Execution Technology
Y
Intel® Hyper Threading Technology (Intel® HT Technology)
Y
Intel® Turbo Boost Technology
2.0
Intel® vPro™ Platform Eligibility
Y
Intel Clear Video Technology
N
Intel® InTru™ 3D Technology
N
Intel Virtualization Technology for Directed I/O (VT-d)
Y
Intel Software Guard Extensions (Intel SGX)
Y
Intel® Clear Video HD Technology (Intel® CVT HD)
N
Intel Virtualization Technology (VT-x)
Y
Intel® Quick Sync Video Technology
N
Intel® AES New Instructions (Intel® AES-NI)
Y
Intel VT-x with Extended Page Tables (EPT)
Y
Intel® Optane™ Memory Ready
Y
Processor
Processor lithography
14 nm
Processor operating modes
64-bit
Processor family
Intel Xeon E
Processor socket
LGA 1151 (Socket H4)
Processor boost frequency
4.8 GHz
Component for
Server/Workstation
Processor frequency
3.4 GHz
Processor manufacturer
Intel
Processor codename
Coffee Lake
Memory
Memory types supported by processor
DDR4-SDRAM
Maximum internal memory supported by processor
128 GB
Memory clock speeds supported by processor
2666 MHz
Memory channels
Dual-channel
Other features
Graphics
On-board graphics adapter
N
On-board graphics adapter 4K support
N
Discrete graphics adapter model
Not available
Discrete graphics adapter
N
On-board graphics adapter model
Not available
Weight & dimensions
Processor package size
37.5 x 37.5 mm
Technical details
Maximum resolution & refresh rate (DisplayPort)
N/A
Features
PCI Express CEM revision
3.0
Harmonized System (HS) code
8542310001
Embedded options available
N
Thermal Monitoring Technologies
Y
PCI Express slots version
3.0
Supported instruction sets
SSE4.1,SSE4.2,AVX 2.0
Maximum number of PCI Express lanes
16
PCI Express configurations
1x16,2x8,1x8+2x4
Operational conditions
Power
Thermal Design Power (TDP)
80 W
